Chemorheology of Thermosetting Polymers by Clayton A. May (Eds.)

By Clayton A. May (Eds.)

content material: method automation : a rheological and chemical review of thermoset curing / C.A. might, M.R. Dusi, J.S. Fritzen, D.K. Hadad, M.G. Maximovich, K.G. Thrasher, and A. Wereta, Jr. --
treatment kinetics and mechanical homes of a resin matrix : results of impurities and stoichiometry / Gary L. Hagnauer, Peter J. Pearce, Bernard R. Laliberte, and Margaret E. Roylance --
Kinetics of acetylene-terminated resin healing and its results on dynamic mechanical homes / I.J. Goldfarb, C.Y-C. Lee, and C.C. Kuo --
Acetylene-terminated resin remedies : air and nitrogen results / C.Y-C. Lee, C.C. Kuo, and I.J. Goldfarb --
Mechanism and kinetics of the curing approach in a resin process / J. Moacanin, M. Cizmecioglu, S.D. Hong, and A. Gupta --
Moisture-temperature results at the dynamic mechanical houses of epoxy polymers / Wayne J. Mikols and James C. Seferis --
Cross-linking response of an epoxy resin with phthalic anhydride / Elbert W. Crandall and Winston Mih --
Chemiluminescence of thermosetting resins / Clarence J. Wolf, Dale L. Fanter, and Michael A. Grayson --
Poly(n-butyl methacrylate) and poly(butyl methacrylate-co-acrylic acid) movies : dried from options of hydrogen bonding strength / Michael S. Chuu, Carl J. Knauss, Richard J. Ruch, and Raymond R. Myers --
healing of intaglio printing inks / D.L. Hunston, J.L. Rushford, W.R. Newitt, and B.A. Vandreuil --
Curing habit of segmented polyurethane adhesives / D. Mark Hoffman --
Rheological medication transformation diagrams for comparing polymer remedy dynamics / Richard J. Hinrichs --
Curing kinetics of unsaturated polyester and vinyl ester resins / Chang Dae Han and Kwok-Wai Lem --
Dynamic mechanical and dielectric houses of an epoxy resin in the course of remedy / W.X. Zukas, W.J. Macknight, and N.S. Schneider --
Reactive structures : finite point research / Craig Douglas and David Roylance --
Kinetic version of therapy reactions : aids to estate and processing predictions / H.S.-Y. Hsich, R.M. Zurn, and R.J. Ambrose --
Thermosetting coatings : analytical and predictive strength by way of chemorheology / Richard R. Eley --
Predictive versions as aids to thermoset resin processing / M.R. Dusi, C.A. might, and J.C. Seferis.

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Example text

DSC Study. From th of the commercial and f r a c t i o n a t e d TGMDA resin/DDS formulations over a broad s t o i c h i o m e t r i c range, i t i s concluded that the t o t a l heat o f r e a c t i o n d i v i d e d by the epoxy concentration has a constant value tot (eq. epoxy/100g) . H (epoxy-amine) = *1H (epoxy) (13) Thus the assumption that t h e DSC parameter α represents t h e o v e r a l l extent o f r e a c t i o n i s v a l i d , and comparisons o f q u i t e d i f f e r e n t r e s i n formulations and c o r r e l a t i o n s between DSC and GPC data may be made.

Having o b t a i n e d Τ as a f u n c t i o n o f c o n v e r s i o n and conver­ s i o n as a f u n c t i o n o f rime f o r d i f f e r e n t temperatures, i t i s p o s s i b l e t o c o n s t r u c t the t i m e - t e m p e r a t u r e - t r a n s f o r m a t i o n (TTT) diagram as d e s c r i b e d by Enns and G i l l ham (10). The r e s u l t s are shown i n F i g u r e 3. The c i r c l e d p o i n t s were o b t a i n e d by i n t e r ­ p o l a t i n g f o r c o n v e r s i o n f o r each temperature from F i g u r e 2 and a p p l y i n g equation (3) t o c a l c u l a t e the r e a c t i o n time.

POLYMERS 2. HAGNAUER ET A L . 37 Impurities and Stoichiometry of Resin Matrix parameters beyond the onset o f g e l a t i o n and the downward curvature o f the p l o t s are a consequence o f the f a c t that only s o l u b l e components can be analyzed by GPC and that the highest MW products tend t o be incorporated i n t o the g e l network f i r s t . Most l i k e l y , Μ curves downward e a r l y because t h e GPC c a l i b r a t i o n i s no longer a p p l i c a b l e a t r e l a t i v e l y high extents o f r e a c t i o n where a v a r i e t y o f h i g h l y branched products are formed.

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